Negotiable
The date of payment from buyers deliver within days
Guangdong
Long-term effective
2019-11-16 12:13
350
Company Profile
SFG Electronic Technology Co., LimitedBy certification [File Integrity]
Contact:songhuijd(Mr.)
Email:
Telephone:
Phone:
Area:Guangdong
Address:Guangdong
Website:http://www.sfgsmt.com/ http://songhuijd.eastseabath.com/
Specification
Model ID |
NPM-D3 |
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Rear head |
Lightweight |
12-nozzle head |
8-nozzle head |
2-nozzle head |
Dispensing head |
No head |
Lightweight 16-nozzle head |
NM-EJM6D |
NM-EJM6D-MD |
NM-EJM6D |
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12-nozzle head | ||||||
8-nozzle head | ||||||
2-nozzle head | ||||||
Dispensing head |
NM-EJM6D-MD |
NM-EJM6D-D |
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Inspection head |
NM-EJM6D-MA |
NM-EJM6D-A |
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No head |
NM-EJM6D |
NM-EJM6D-D |
PCB dimensions*1 |
Dual-lane mode |
L 50 x W 50 ~ L 510 x W 300 |
Single-lane |
L 50 x W 50 ~ L 510 x W 590 |
|
PCB |
Dual-lane |
0 s* *No 0s when cycle time is 3.6 s or less |
Single-lane |
3.6 s* *When selecting short conveyors |
|
Electric source |
3-phase AC 200, 220, 380, 400, 420, 480 V 2.7 kVA |
|
Pneumatic source *2 |
0.5 MPa, 100 L /min (A.N.R.) |
|
Dimensions *2 (mm) |
W 832 x D 2 652 *3 x H 1 444 *4 |
|
Mass |
1 680 kg (Only for main body:This differs depending on the option configuration.) |
Placement head |
Lightweight 16-nozzle head |
12-nozzle head |
8-nozzle head |
2-nozzle head |
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High production mode [ON] |
High production mode [OFF] |
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Max. speed |
42 000 cph |
38 000 cph |
34 500 cph |
21 500 cph |
5 500 cph (0.655 s/ chip) |
|
Placement accuracy |
± 40 µm/chip |
±30 μm / chip |
±30 μm / chip |
± 30 µm/chip □ 32mm |
± 30 µm/QFP |
|
Component dimensions (mm) |
0402 chip*6 to L 6 x W 6 x T 3 |
03015*6*7/0402 chip*6 to L 6 x W 6 x T 3 |
0402 chip*6 to L 12 x W 12 x T 6.5 |
0402 chip*6 to L 32 x W 32 x T 12 |
0603 chip to L 100 x W 90 x T 28 |
|
Component |
Taping |
Tape : 4 / 8 / 12 / 16 / 24 / 32 / 44 / 56 mm |
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Taping |
Max. 68 (4, 8 mm tape, Small reel) |
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Stick |
Max.16 (Single stick feeder) |
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Tray |
Max.20 (per tray feeder) |
Dispensing head |
Dot dispensing |
Draw dispensing |
Dispensing speed |
0.16 s/dot (Condition : XY=10 mm, Z=less than 4 mm movement, No θ rotation) |
4.25 s/component (Condition: 30 mm x 30 mm corner dispensing)*8 |
Adhesive position accuracy |
± 75 μ m /dot |
± 100 μ m /component |
Applicable components |
1608 chip to SOP,PLCC,QFP, Connector, BGA, CSP |
SOP,PLCC,QFP, Connector, BGA, CSP |
Inspection head |
2D inspection head (A) |
2D inspection head (B) |
|
Resolution |
18 µm |
9 µm |
|
View size (mm) |
44.4 x 37.2 |
21.1 x 17.6 |
|
Inspectionb processing |
Solder |
0.35s/ View size |
|
Component |
0.5s/ View size |
||
Inspection |
Solder |
Chip component : 100 μm x 150 μm or more (0603 mm or more) |
Chip component : 80 μm x 120 μm or more (0402 mm or more) |
Component |
Square chip (0603 mm or more), SOP, QFP (a pitch of 0.4 mm or more), CSP, BGA, Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector*10 |
Square chip (0402 mm or more), SOP, QFP (a pitch of 0.3 mm or more), CSP, BGA,Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector*10 |
|
Inspection |
Solder |
Oozing, blur, misalignment, abnormal shape, bridging |
|
Component |
Missing, shift, flipping, polarity, foreign object inspection *11 |
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Inspection position accuracy *12 |
± 20 μm |
± 10 μm |
|
No. of |
Solder |
||
Component |
*1 : |
Due to a difference in PCB transfer reference, a direct connection with NPM (NM-EJM9B) / NPM-W (NM-EJM2D) /NPM-W2 (NM-EJM7D) dual lane specs cannot be established. |
*2 : |
Only for main body |
*3 : |
Dimension D including tray feeder : 2 683 mm |
*4 : |
Excluding the monitor, signal tower and ceiling fan cover. |
*5 : |
±25 μm placement support option.(Under conditions specified by Panasonic) |
*6 : |
The 03015/0402 mm chip requires a specific nozzle/feeder. |
*7 : |
Support for 03015 mm chip placement is optional.(Under conditions specified by Panasonic:Placement accuracy ±30 μm / chip ) |
*8 : |
A PCB height measurement time of 0.5s is included. |
*9 : |
One head cannot handle solder inspection and component inspection at the same time. |
*10 : |
Please refer to the specification booklet for details. |
*11 : |
Foreign object is available to chip components. (Excluding 03015 mm chip) |
*12 : |
This is the solder inspection position accuracy measured by our reference using our glass PCB for plane calibration. It may be affected by sudden change of ambient temperature. |
*Placement tact time, inspection time and accuracy values may differ slightly depending on conditions.
*Please refer to the specification booklet for details.
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